Microchip Technology (Thailand) Co.,Ltd.

MMT offers total Turn-Key Solutions for your semiconductor packaging needs:

• Wafer Back Grinding: 8 inch max Si, GaN,

• Wafer Probe

• Assembly (Plastics & Special Products , GaAs wafers)

• Hermeticity Testing - Fine Leak with Kr85 & Gross Leak

• Temperature Cycling

• PIND Testing and Burn–In

• Final Test – memory, analog, mixed signals & logic devices

• Solder Dip (63/37, 95/5)

• Drop Shipment

• Full Reliability Test Capability

• Plating Services (Matte Tin,Tin-Lead)

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*Ceramic* *Package*	*Plastic* *Package*	*PCBA*	*Image Sensor* *Package*	*Metal Cans* *Package*	*Wafer* *Probe*	*Plating* *Service*
Full range of HiRel ceramic packaging services. Portfolio includes: CDIP, LCC, Side braze CQFP, Flat packs, PGA, MCM, SIP, and Flip Chip BGA.	Full range of HiRel plastic packaging services. PLCC, SOIC PDIP, SOJ QSOP, MQFP QFN, TSSOP	PCBA assembly capable of handling down to 01005 component size	High-End Image Sensor assembly in a dedicated super clean Class 100	Wide range of metal cans TO3, TO99 TO18, TO5 TO39	Probing in class 100 and 10k	100% Matte Tin on Cu, Alloy frame. High speed strip-to-strip plating line.