Ceramic
Package
|
Plastic
Package
|
PCBA
|
Image Sensor
Package
|
Metal Cans
Package
|
Wafer
Probe
|
Plating
Service
|
 Full range of HiRel
ceramic packaging
services.
Portfolio includes:
CDIP, LCC, Side braze
CQFP, Flat packs, PGA,
MCM, SIP, and Flip
Chip BGA.
 |
 Full range of HiRel
plastic packaging
services.
PLCC, SOIC
PDIP, SOJ
QSOP, MQFP
QFN, TSSOP
 |
 PCBA assembly
capable of
handling down
to 01005
component size
 |
 High-End Image
Sensor assembly
in a dedicated
super clean Class 100
 |
 Wide range of
metal cans
TO3, TO99
TO18, TO5
TO39
 |
 Probing in
class 100 and 10k
 |
 100% Matte Tin on
Cu, Alloy frame.
High speed
strip-to-strip
plating line.
 |
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